FGP30B thru fgp30d document number 88878 10-aug-05 vishay semiconductors www.vishay.com 1 p a t e n t e d * do-204ac (do-15) ? * glass encapsulation technique is covered by patent no. 3,996,602, brazed-lead assembly to patent no. 3,930,306 n ew p ro duct glass passivated ultrafast rectifier major ratings and characteristics i f(av) 3.0 a v rrm 100 v to 200 v i fsm 125 a t rr 35 ns v f 0.95 v i r 5.0 a t j max. 175 c features cavity-free glass-passivated junction ideal for automated placement ultrafast reverse recovery time low switching losse s, high efficiency high forward surge capability meets environmental standard mil-s-19500 solder dip 260 c, 40 seconds typical applications for use in high frequency rectification and freewheel- ing application in switch ing mode converters and inverters for consumer, computer, automotive and telecommunication mechanical data case: gp20, molded epoxy over glass body epoxy meets ul-94v-0 flammability rating terminals: matte tin plated leads, solderable per j-std-002b and jesd22-b102d e3 suffix for commercial grade, he3 suffix for high reliability grade (aec q101 qualified) polarity: color band denotes cathode end maximum ratings t a = 25 c unless otherwise specified parameter symbol FGP30B fgp30c fgp30d unit maximum repetitive peak reverse voltage v rrm 100 150 200 v maximum rms voltage v rms 70 105 140 v maximum dc blocking voltage v dc 100 150 200 v maximum average forward rectified current 0.375" (9.5 mm) lead length at t a = 25 c i f(av) 3.0 a peak forward surge current 8.3 ms single half sine-wave superimposed on rated load i fsm 125 a operating junction and storage temperature range t j , t stg - 65 to + 175 c
www.vishay.com 2 document number 88878 10-aug-05 FGP30B thru fgp30d vishay semiconductors electrical characteristics t a = 25 c unless otherwise specified notes: (1) pulse test: 300 s pulse width, 1 % duty cycle thermal characteristics t a = 25 c unless otherwise specified notes: (1) thermal resistance from juction to ambient at 0.375" (9.5 mm) lead length and mounted on p.c.b. with 1.1 x 1.1 (30 x 30 mm) copper pads. (2) thermal resistance from junction to lead at 0.375" (9 .5 mm) lead length with both leads attached to heatsinks. ratings and characteristics curves (t a = 25 c unless otherwise specified) parameter test condition symbol FGP30B fgp30c fgp30d unit maximum instantaneous forward voltage at 3.0 a (1) v f 0.95 v maximum dc reverse current at rated dc blocking voltage t a = 25 c t a = 100 c i r 5.0 50 a maximum reverse recovery time at i f = 0.5 a, i r = 1.0 a, i rr = 0.25 a t rr 35 ns typical junction capacitance at 4.0 v, 1 mhz c j 70 pf parameter symbol FGP30B fgp30c fgp30d unit typical thermal resistance (1,2) r ja r jl 55 20 c/w figure 1. maximum forward current derating curve 3,5 3 2,5 2 1,5 1 0,5 0 0 25 50 75 100 125 150 175 a v erage for w ard rectified c u rrent (a) am b ient temperat u re (c) figure 2. maximum non-repetitive peak forward surge current peak forward surge current (a) number of cycles at 60 h z 1 10 100 25 50 75 100 125 150 0 t j =t j max. 8.3ms single half sine-wave
FGP30B thru fgp30d document number 88878 10-aug-05 vishay semiconductors www.vishay.com 3 package outline dimensions in inches (millimeters) figure 3. typical instantaneous forward characteristics figure 4. typical revers e leakage characteristics t j = 175 c t j = 25 c t j = 150 c t j = 125 c 0,2 0,4 0, 8 1 1,2 0,6 100 10 1 0,1 0,01 instantaneo u s for w ard c u rrent (a) instantaneo u s for w ard v oltage ( v ) 20 40 60 8 0 100 percent of rated peak re v erse v oltage ( % ) instantaneo u s re v erse leakage c u rrent ( a) t j = 175 c t j = 150 c t j = 25 c 100 10 1 0,1 0,01 0,001 t j = 125 c figure 5. typical junction capacitance figure 6. typical trans ient thermal impedance re v erse v oltage ( v ) j u nction capacitance (pf) 1000 100 10 1 0,1 1 10 100 1 10 100 tp-p u lse d u ration (sec) transient thermal impedance (c/ w ) 0,01 0,1 1 10 100 0.034 (0.86) 0.028 (0.71) dia. 0.140 (3.6) 0.104 (2.6) dia. 0.230 (5.8) 0.300 (7.6) 1.0 (25.4) min. 1.0 (25.4) min. do-204ac (do-15)
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